In the second quarter of 2025, the demand for 212.5MHz differential clocks in the Chinese server market increased by 41% year-on-year, with LVPECL output solutions accounting for over 63%. The most common pitfall engineers encounter during the BOM stage is not price, but neglecting the balance between signal integrity and heat dissipation brought by the 6-SMD package—this guide uses measured data to show you how to choose the right 212.5MHz crystal oscillator in one go. 212.5MHz Application Scenarios and Technical Trends 212.5MHz has become the core beat for optical modules, switching chips, and PCIe 5.0 clock trees. Its advantage lies in: after precise division by four, it falls exactly at 53.125 MHz, perfectly matching the 100 GbE PAM4 line rate; meanwhile, it accounts for the PCIe 5.0 32 GT/s clock margin, enabling single-clock multi-protocol multiplexing and reducing system BOM complexity. Why Optical Modules, Switches, and PCIe 5.0 Clock Trees Prefer 212.5MHz 100 GbE PAM4: 212.5 MHz ÷ 4 = 53.125 MHz, zero error in channel spacing PCIe 5.0: 212.5 MHz × 8 = 1.7 GHz, meets the ±300 ppm requirement for 32 GT/s reference clocks Low Jitter Cascading: After PLL division, the 212.5 MHz master clock still maintains < 0.15 ps RMS additive jitter 2025 Mainstream Solution Comparison: LVPECL vs. HCSL vs. CML Output Type Phase Jitter (ps) Power Consumption (mA) Common Mode Voltage (V) Routing Difficulty LVPECL 0.3 45 2.0 Medium HCSL 0.5 35 0.35 High CML 0.2 25 1.2 Low Deep Dissection of 6-SMD Package Structure The 2.0 mm × 1.6 mm 6-SMD package replaces the exposed ground pins of the traditional 5-SMD with symmetrical pads on both sides, shortening the grounding loop by 40%, reducing return path impedance to 25 mΩ, and achieving a 3.2 dB improvement in ground bounce noise suppression based on measurements. Pin Mapping and PCB Escape Methods for 2.0 mm × 1.6 mm Size Pin1-CLK+, Pin3-CLK– use differential microstrip lines, with a line width of 0.11 mm and spacing of 0.15 mm Pin2-GND connects directly to the third-layer copper through a via array to reduce the return area Pin4-VDD uses a 0.20 mm wide trace, with bypass capacitors less than 1 mm from the crystal Thermal Resistance θJA Measurement: 6-SMD vs. 5-SMD vs. 3225 Metal Lid 6-SMD (78) 5-SMD (90) 3225 Metal Lid (72) At 25 °C ambient temperature and 0 m/s wind speed, the 6-SMD package reduces thermal resistance by 12 °C/W compared to the 5-SMD, while saving 37% of board space. Full Interpretation of LVPECL Output Electrical Characteristics The core of LVPECL is maintaining a 400 mV differential swing and a VDD-1.3 V common-mode point. To achieve a measured phase jitter < 0.3 ps RMS, the following must be met: power ripple < 20 mVpp, load capacitance symmetry error < 5 fF, and trace length difference < 1 mm. Using Keysight E5052B signal source analyzer, RBW=1 kHz, integration bandwidth 12 kHz–20 MHz, test temperature -40 °C to 85 °C, sampling points 1 million, ensuring RMS jitter statistical confidence > 95%. 3.3 V/2.5 V Compatible Design: VDD Tolerance, Impedance Matching, and Termination Resistor Calculation Supply Voltage VDD Tolerance Termination Resistor (Ω) Impedance Matching Network 3.3 V ±5 % 50 to VDD-2 V 50 Ω // 50 Ω 2.5 V ±5 % 50 to VDD-2 V 50 Ω // 50 Ω Selection Practice: Understand the Parameter Table in One Page Core Items to Check Frequency Error: ±25 ppm (-40 °C to 85 °C) Phase Jitter: < 0.3 ps RMS (12kHz–20MHz) Rise/Fall Time: 0.4 ns typ @ 20%–80% Current Consumption: 45 mA max @ 3.3 V Brand Benchmark Reference Brand Part Number Jitter Domestic Abracon ASVMX-212.5 0.3ps Japanese ECS ECX-P37CM-212.5 0.25ps American Microchip MX573ABA212M5 0.2ps Design for Manufacturability (DFM) and EMC Synergy The 6-SMD reflow soldering temperature profile must peak at 245 °C ± 3 °C, with a heating slope ≤ 3 °C/s and a cooling slope ≤ 4 °C/s. Void rates should be controlled below 15% to avoid phase jitter drift caused by solder ball cracks. 3-Step Method for Crosstalk Suppression Near High-Speed SerDes Routing 1 212.5 MHz clock traces should be ≥ 3 times the trace width (≥0.33 mm) from SerDes differential pairs 2 Apply 0.20 mm ground copper on both sides of the clock lines to form microstrip shielding 3 Add a narrow-band LC notch filter (212.5 MHz ± 10 MHz) at the SerDes receiver end 2025 Procurement and Cost Strategies Procurement Region Stock Inventory Lead Time (Weeks) Unit Price (CNY) East China Warehouse 3k 1 6.8 South China Warehouse 5k 2 6.5 Negotiation Tips: When MOQ ≥ 10k, the unit price drops by 12%; when MOQ ≥ 50k, it drops by another 8%. Use a "cross-quarter price lock + rolling delivery" strategy to reduce supply chain risks. Key Summary • 212.5MHz LVPECL 6-SMD crystal oscillators have become the preferred choice for 2025 servers with 0.3 ps RMS jitter and 78 °C/W thermal resistance. • In the 2.0 mm × 1.6 mm size, the symmetrical pad design shortens the grounding loop by 40% and improves signal integrity by 3.2 dB. • 3.3 V/2.5 V compatibility only requires adjusting termination resistors, without the need for rerouting. • Stock in East and South China is sufficient; with MOQ ≥ 10k, the 6.5–6.8 yuan price range can be locked. Frequently Asked Questions How to verify jitter margin for 212.5MHz crystal oscillators in PCIe 5.0 applications? + Use E5052B for testing with an integration bandwidth of 12 kHz–20 MHz, targeting < 0.3 ps RMS; meanwhile, run a BERT 1e-12 bit error rate test on the system board for 24 hours to confirm eye opening > 0.4 UI. Can the 6-SMD package replace the 3225 metal lid for -40 °C environments? + Yes. The measured θJA difference is only 6 °C/W. At -40 °C, the startup current is < 20 mA, and the phase jitter drift is < 0.02 ps; as long as the PCB copper is ≥ 2 oz, heat dissipation requirements can be met. How to directly interface LVPECL output with FPGA HR Bank? + The FPGA HR Bank should enable internal 100 Ω differential termination and add a 50 Ω pull-up to VDD-2 V near the crystal end. This can eliminate two external resistors and save 12 mm² of area.

In the PCB design of AI servers and high-speed optical modules, a seemingly tiny component—the 312.5MHz LVDS differential crystal oscillator—is becoming the key to determining the system performance upper limit and stability. Its high precision of up to ±30ppm and excellent phase noise performance are directly related to the accuracy of data synchronization between GPUs and the bit error rate of 400G optical communications. Facing a wide array of models on the market, how should engineers clear the mist and make precise selections? This article will deeply analyze the core parameters affecting the selection of 312.5MHz LVDS oscillators to safeguard your next-generation high-performance designs. Driven by Application Scenarios: Why 312.5MHz LVDS Becomes a High-End Standard? The 312.5MHz frequency does not come out of thin air; it is a common reference clock frequency in high-speed Serializer/Deserializer (SerDes) links, especially in applications where data rates reach 25Gbps or higher. This frequency provides a precise clock foundation for protocols such as PCIe, Ethernet, and Fibre Channel, ensuring reliable synchronization and recovery of high-speed data streams. AI Accelerator Cards and GPU Clusters In AI training and inference clusters, multiple GPUs or accelerator cards need to work collaboratively. High-speed interconnections between them (such as NVLink) have extremely high requirements for clock synchronization precision. The 312.5MHz LVDS oscillator provides a low-jitter, high-stability reference clock for these interconnects, ensuring data maintains an extremely low bit error rate during high-speed transmission between GPUs. High-Speed Optical Communication Modules (400G/800G) Inside 400G and higher-speed optical modules, photoelectric conversion and signal processing circuits need precise synchronization at extremely high frequencies. The low-phase-noise clock generated by the 312.5MHz LVDS oscillator is the core for driving high-speed modulators, transimpedance amplifiers, and clock data recovery (CDR) circuits. Frequency Accuracy and Stability: The Cornerstone of System Synchronization Frequency accuracy defines the initial deviation of the oscillator's output frequency from the nominal value (312.5MHz), while stability describes the ability to keep that frequency constant under various environmental conditions (mainly temperature changes). Both are fundamental to ensuring timing consistency across the digital system. Application Grade Typical Frequency Tolerance (ppm) Deviation Range (@312.5MHz) Applicable Scenarios Consumer Grade ±50 ppm ±15.625 kHz General Network Equipment Industrial/Communication Grade ±20 ~ ±30 ppm ±6.25 ~ ±9.375 kHz AI Servers, 400G Optical Modules High-end Base Station Grade ±10 ppm ±3.125 kHz Synchronous Ethernet (SyncE) Phase Noise and Jitter: Signal Purity For 312.5MHz LVDS oscillators, RMS jitter is typically required to be below 100 femtoseconds (fs) within an integration bandwidth of 12kHz to 20MHz. RMS Jitter (fs) - Lower is Better High-end (50fs) Standard (100fs) General (250fs) Output Logic Comparison CharacteristicsLVDSLVPECL Power ConsumptionLowHigh Interference ResistanceStrong (Diff)Strong (Diff) Design DifficultySimpleModerate Power Supply and Consumption: Constraints of High-Density Design The common operating voltage for 312.5MHz LVDS oscillators is 3.3V. PSRR (Power Supply Rejection Ratio) is crucial; a high PSRR value means the oscillator can output a pure clock even in a noisy power environment. Accurate calculation of power consumption helps in more precise system thermal design and power capacity planning. Package and Reliability: 3225 Mainstream Choice 3225 (3.2mm x 2.5mm) is the current mainstream package size. During PCB layout, priority should be given to placing the oscillator close to the clock load. Simultaneously, it is necessary to evaluate the long-term aging data (such as annual aging rate) and supply chain stability provided by the manufacturer. Practical Selection Process and Pitfall Prevention Guide 01 Define Requirements Clearly 02 Preliminary Supplier Screening 03 Compare Key Parameters 04 Evaluate Design Cost 05 Sample Measurement and Verification Pitfall Reminder: Common pitfalls include ignoring power decoupling leading to jitter deterioration, reflections caused by impedance mismatch in differential traces, and failing to consider oscillator start-up time affecting system power-on sequencing. Key Summary Application Sets the Tone: The 312.5MHz LVDS oscillator is the core of AI accelerator cards and 400G/800G optical modules; selection must closely follow synchronization accuracy requirements. Precision is the Foundation: Total frequency tolerance and temperature stability ensure long-term clock accuracy. Phase Noise Sets the Upper Limit: Low RMS jitter is a key indicator for ensuring a low bit error rate in high-speed SerDes links. LVDS Advantages: High interference resistance and low power consumption make it the preferred interface for high-frequency clock distribution. Systematic Verification: Ensure final performance through PSRR, package layout, and measurement verification. FAQ Why is the jitter specification of the 312.5MHz LVDS oscillator so important in AI servers? + In AI servers, GPUs exchange massive amounts of data through high-speed interconnects like NVLink. Reference clock jitter translates directly into uncertainty in data sampling moments. Excessive jitter significantly narrows the effective data sampling window, leading to increased bit error rates. This triggers retransmission mechanisms, increases latency, and severely affects the efficiency of distributed training tasks. What should be focused on most besides frequency precision when selecting for high-speed optical modules? + Phase noise (or jitter) is paramount. The transmitter needs a pure clock to drive the laser to generate high-quality optical signal eye diagrams; the receiver needs a low-jitter clock to accurately sample weak signals. Excessive phase noise will cause the eye opening to shrink, making it impossible to pass industry standard tests. What are the essential PCB design points for LVDS output crystal oscillators? + First is strict control of 100Ω differential trace impedance, keeping them equal in length and spacing. Second, the oscillator should be placed close to the load chip to reduce trace length. Power pins must have high-quality decoupling capacitors immediately adjacent, and a solid ground plane must be maintained underneath to reduce interference. Choosing a suitable 312.5MHz LVDS oscillator is a comprehensive engineering task. Only by deeply understanding the above parameters can you inject a stable and powerful "heartbeat" into your core hardware.

In the fields of precision timing, communication base stations, and high-end test instruments, the 10MHz Oven Controlled Crystal Oscillator (OCXO) is the core "heart" that determines system performance. Facing numerous choices on the market ranging from general-purpose to ultra-high-performance types, engineers often struggle between "parameter-first" or "cost-priority." This article will analyze the technical characteristics and application scenarios of five mainstream 10MHz OCXO types through a horizontal data comparison of key performance parameters, helping you make the most suitable data-driven choice for your project requirements. 01 Core Parameter Interpretation: How to Read an OCXO Datasheet? The first step in choosing an OCXO is understanding its technical specifications. Frequency stability, phase noise, aging rate, and power consumption are the four core parameters that together define the performance boundaries and application potential of the oscillator. Frequency Stability vs. Phase Noise Frequency stability measures the degree to which the oscillator's output frequency changes with environmental factors such as temperature and voltage, usually expressed in ppb (parts per billion). For systems requiring a long-term stable clock reference, such as communication base station synchronization, this is the primary consideration. Phase noise describes short-term frequency stability, representing the spectral purity of the signal, which is critical for the performance of RF systems, radars, and high-speed data converters. The two have different focuses, and a balance must be struck based on the "long-term stability" or "short-term stability" requirements of the application scenario. Aging Rate and Power Consumption The aging rate refers to the slow, unidirectional drift of the oscillator's frequency over time, usually measured in ppb/day or ppb/year. A low aging rate is key to ensuring long-term (multi-year) stable operation of the system, especially suitable for metrology and timing systems. Power consumption is directly related to the system's thermal design and power supply solution, particularly for portable or battery-powered equipment. High-performance OCXOs often require higher heating power to maintain the oven temperature, so a balance point must be found between extreme stability and energy efficiency. Horizontal Data Comparison of 5 Mainstream 10MHz OCXO Types OCXO Type Frequency Stability (ppb) Daily Aging Rate (ppb) Phase Noise (10Hz) Power Consumption (W) Economical General-Purpose ±50 ~ ±100 ~ 1.0 -130 dBc/Hz 1.5 - 2.5 Low Power Compact ±100 ~ 2.0 -125 dBc/Hz < 0.6 High Stability ±10 ~ ±20 < 0.5 -140 dBc/Hz 2.0 - 3.5 Ultra-Low Phase Noise ±50 ~ 1.0 -145 ~ -155 dBc/Hz 3.0 - 5.0 Ultra-High Precision < ±1 (sub-ppb) < 0.1 -140 dBc/Hz 5.0+ Economical General-Purpose: Best Cost Solution Suitable for cost-sensitive industrial control, general test equipment, and other scenarios requiring better performance than a TCXO. Low Power Compact: Preferred for Portable Devices Aimed at IoT terminals and portable instruments, reducing power consumption to the level of hundreds of milliwatts with extremely small package sizes. High Stability: Harsh Environment Applications Widely used in satellite communications, high-end spectrum analyzers, and systems requiring long-term timekeeping capabilities. Ultra-Low Phase Noise: RF Core Offers excellent performance at close-in carrier offsets, significantly improving system signal-to-noise ratio and bit error rate. From Parameters to Application: Typical Project Selection Guide 01 Scenario 1: 5G Base Station Synchronization and Broadcasting Equipment 5G networks have strict requirements for time synchronization to satisfy TDD modes and Coordinated Multi-Point (CoMP) transmission. Such projects typically require high stability OCXOs to ensure time errors between base stations are within hundreds of nanoseconds. Simultaneously, phase noise performance must be monitored to guarantee RF signal quality. Broadcasting equipment also relies on high-stability clocks to avoid signal interference. 02 Scenario 2: Portable Spectrum Analysis and Field Test Equipment These devices need to maintain sufficient measurement accuracy in mobile and outdoor environments. Low power compact OCXOs are the preferred choice, as they provide better stability than TCXOs while effectively controlling the overall power consumption and heat generation, extending battery life, and reducing device volume. 03 Scenario 3: Financial Trading Systems and Data Center Clocks High-frequency trading requires timestamp accuracy at the microsecond or even nanosecond level, and distributed systems in data centers also require precise clock synchronization. It is recommended to use high stability or ultra-low phase noise OCXOs to ensure absolute accuracy of time markers and clock consistency within the network, reducing trading conflicts and data synchronization errors. Beyond the Datasheet: Hidden Costs and Risks in Selection Supply Chain Stability and Lead Times For mass production projects, the OCXO supplier's capacity, lead times, and long-term supply commitment are crucial. Preference should be given to manufacturers with stable wafer and packaging supply chains, and second-source plans should be evaluated to avoid supply disruption risks. The Necessity of Upgrading from TCXO to OCXO This is not just a leap in performance, but also means an increase in cost, power consumption, and volume. Before making a decision, it is necessary to quantify whether the system-level benefits brought by performance improvements (such as improved communication quality and enhanced measurement accuracy) are sufficient to cover the increased total lifecycle cost. Future Trends and Procurement Action Checklist Currently, by improving heater design, adopting new thermal insulation materials, and MEMS crystal technology, the industry is launching OCXO products with smaller sizes, shorter thermal start-up times, and lower power consumption. This allows OCXOs to enter more application spaces previously dominated by TCXOs. Four-Step Selection Method Step 1 Define hard indicators for project stability, phase noise, power consumption, size, and cost. Step 2 Screen 2-3 candidate models based on requirements and perform detailed parameter comparison. Step 3 Comprehensively evaluate the technical support capabilities, quality systems, and supply chain strength of potential suppliers. Step 4 Be sure to conduct actual sample testing to verify long-term stability and adaptability in real application environments. Key Summary ● Parameters are the foundation, application is the yardstick: When choosing a 10MHz OCXO, core parameters must be closely integrated with the priority of specific application scenarios (such as 5G synchronization, portable instruments, metrology research) to avoid over-design. ● Five mainstream types, each with its own role: The market is mainly divided into economical general-purpose, low power compact, high stability, ultra-low phase noise, and ultra-high precision, meeting different needs from industry to top-tier scientific research. ● Evaluate hidden costs and future trends: Consider supply chain risks and technical upgrade paths, and pay attention to progress in miniaturization and low-power technologies. Frequently Asked Questions How to balance OCXO performance and cost in budget-constrained projects? + First, accurately evaluate the minimum performance baseline the project must achieve. Among models that meet this baseline, choose the most cost-optimal solution, which is usually an economical general-purpose OCXO. Consider sacrificing some non-critical indicators (such as choosing a model with a narrower operating temperature range) to reduce costs. Also evaluate the total lifecycle cost; sometimes a slightly higher initial investment is more economical due to a lower failure rate. Which is more important for communication base station projects: phase noise or frequency stability? + For communication base stations, both are important. Frequency stability is directly related to the time synchronization accuracy between base stations, which is the foundation for the normal operation of modes like 5G TDD, and is usually the primary indicator to guarantee. Phase noise mainly affects the purity of the RF transmission signal and the sensitivity of the receiver. When resources are limited, priority should be given to ensuring that frequency stability meets the standard. Why is it necessary to conduct actual tests on OCXO samples instead of just looking at the datasheet? + Datasheets provide typical values, but actual performance can vary depending on production batches and specific usage environments (such as PCB layout, cooling conditions, power supply noise). Actual testing can verify the true performance of samples under specific application conditions, especially short-term frequency drift, phase noise under specific loads, etc. Sample testing is key to reducing risks in the later stages of a project.

10MHz OCXO Core Parameters, 2025 Market Dynamics, and Global Inventory Deep Analysis Average Spot Price: ¥168 Temperature Stability: ±10 ppb The average spot price of domestic NJECBLJHNY-10.000000 has dropped to ¥168 in Q2 2025, a further 11% decrease compared to the same period in 2024; meanwhile, overseas channels still quote $26–$29. Why is there such a price difference for the same 10 MHz OCXO? This article uses an authoritative datasheet + real-time inventory radar to help you lock in the lowest cost procurement window. Datasheet Panoramic Quick View: One-time Breakdown of 10MHz OCXO Core Parameters Figure: NJECBLJHNY-10.000000 Package and Internal Architecture Schematic NJECBLJHNY-10.000000, with ±10 ppb temperature stability, 3.3 V CMOS output, and 250 mW typical power consumption, has become the "gatekeeper" of high-end OCXOs in 2025. Frequency Accuracy (±50 ppb) 10.000000 MHz Temperature Drift Performance (-40°C~+85°C) ±10 ppb Steady-state Power Consumption 250 mW 7-SMD Lead-free Package Dimensions and Pad Detail Map Key Dimensions Numerical Indicators Design Remarks Length × Width × Height 14.2 mm × 9.2 mm × 6.5 mm Standard 7-SMD package, pin pitch 2.54 mm Pad Width 1.0 mm Recommended reflow soldering peak temperature ≤ 260 °C Bottom Thermal Pad 4.5 mm × 4.5 mm PCB design must be grounded for heat dissipation to maintain frequency stability Price Trends 2025: Triple Perspective on Spot, Future, and Tiered Pricing Latest market trends in July 2025 show that NJECBLJHNY-10.000000 is experiencing an "internal cold, external hot" inversion phenomenon: Domestic Market (Shenzhen/Shanghai) ¥168 – ¥189 Bulk arrivals from major factories, single batch > 50 k units. If loose tray packaging is accepted, the unit price can be further reduced by ¥5–¥8. Overseas Market (Digi-Key/Mouser) $25 – $29 Lead time remains 12–14 weeks, MOQ 2 k. Under NCNR terms, it can be pushed down to $25.5, but exchange rate risks must be assumed. Inventory Radar: Map of Agent, Trader, and Platform Spot Goods Shenzhen Qianhai Real-time Dynamics Latest Batch: 2025-WK24 Spot Quantity: 18,420 units Compliance: RoHS 10/10, supports QR code traceability Overseas Bonded Warehouse Dispatch Schedule Hong Kong Airport Warehouse: 0–2 days to Shenzhen, 0% tariff Singapore Warehouse: 3–5 days to Shenzhen, 3% tariff US Warehouse: FedEx Priority 7 days, 7% tariff Selection Guide: How to Quickly Verify Designs Using This Datasheet Stability Matching If the system requires ±50 ppb, this OCXO can be used directly; if ±2 ppb is required, digital phase-locking or thermal compensation must be added. FPGA Direct Connection Verification Confirm input threshold is LVTTL 0.8–2.0 V, and trace length must be Cost Reduction in Practice: How to Cut OCXO in BOM to Below ¥150 Model (Same Frequency 10MHz) Stability (Temp) Spot Reference Price Package Compatibility NJECBLJHNY-10.000000 ±10 ppb ¥168 7-SMD (14x9mm) TXC 7N-10.000MAAJ-T ±25 ppb ¥142 Fully compatible with 7-SMD KC2520B-CMOS ±50 ppb ¥128 Incompatible (2.5x2.0mm) 💡 Pro Tip: March and September each year are inventory clearance windows for agents. Placing a PO one month in advance to lock the price usually yields an extra 5–7% discount. Key Summary Core Metrics: ±10 ppb, 3.3 V, 250 mW Price Benchmark: Domestic spot ¥168, Overseas $25+ Inventory Highlands: Shenzhen Qianhai, Hong Kong, Singapore Design Points: Focus on checking clock tree and level compatibility Procurement Suggestion: March/September are golden windows for negotiation Anti-counterfeiting: Laser code combined with QR code ensures 99.7% authenticity rate Frequently Asked Questions (FAQ) What is the maximum startup current in the NJECBLJHNY-10.000000 datasheet? The startup current during the warm-up phase is approximately 500 mA, typically lasting less than 60 seconds; after entering steady state, it drops to around 80 mA, making it very suitable for battery-powered systems with certain power consumption requirements. Can a 10MHz OCXO directly replace a 25 MHz TCXO? Not directly replaceable. Frequency mismatch will cause the backend circuit to fail to lock. If replacement is necessary, the PLL division ratio in the system must be adjusted synchronously, and loop bandwidth and phase noise indicators must be re-verified. Why is there still a price fluctuation of ¥3 for the same batch? This usually stems from differences in packaging format. Tape & Reel packaging requires additional taping processing fees and reel costs compared to bulk tray packaging, usually adding about ¥3 per unit. How often is the inventory radar updated? Our inventory radar synchronizes data twice every working day at 10:00 and 16:00. Real-time spot errors are typically controlled within ±50 units. How to verify that the chips received are original and authentic? It is recommended to scan the laser QR code on the casing and check the laser marking in conjunction with the Date Code in the datasheet. The pass rate for original factory packaging is usually over 99.7%.

Still reworking your FPGA/Switch chip selection for 125MHz LVDS oscillators? A quick-check table + a 5-minute process allows you to determine at a glance whether the OBEWDLVTNY-125 is suitable, completely saying goodbye to "high-speed communication clock selection" pitfalls. ! Quick-Check Table: OBEWDLVTNY-125 Core Parameters Key indicator summary: 125 MHz LVDS output, 3.3 V single power supply, phase jitter 0.05 ps (12 k-20 MHz), package 3.2 mm × 2.5 mm. If these three sets of data match your board specifications, 70% of the selection work is completed. Key Electrical Indicator Comparison Parameter Name Nominal Value Tolerance Range Remarks Output Frequency 125.000 MHz ±25 ppm LVDS Differential Signal Phase Jitter 0.05 ps RMS - 12 k - 20 MHz Bandwidth Supply Voltage 3.3 V ±5 % 65 mA Typical Current Start-up Time 10 ms Max - Measured approx. 3 ms at 25 °C Jitter Performance Visual Comparison (Shorter is Better): Industry Standard (0.3ps) OB-U Series (0.05ps) Package Dimensions and Pin Definitions The OB-U series adopts a 3.2 mm × 2.5 mm × 1.0 mm ceramic package with a standardized 6-pin layout: PIN 1: Output Enable (EN) PIN 2/3: Differential Output (OUT) PIN 4: Ground (GND) PIN 5: No Connection (NC) PIN 6: 3.3 V Power Supply (VDD) ※ PCB pad center distance is 0.65 mm, fully compatible with mainstream FPGA clock input pads. 5-Minute Quick-Matching Process: Three-Step Verification 01 Signal Interface Matching Confirm the board supports LVDS differential: 100 Ω termination resistor near the receiver. For line lengths > 5 cm, differential termination must be added at the end. The OBEWDLVTNY-125 output swing reaches 350 mV, providing sufficient margin. 02 Power Supply and Timing FPGA power-up timing requires the clock to be stable within 1 ms after configuration is complete. The typical start-up time for this model is 3 ms, fully meeting the requirements. If the main controller uses 1.8 V I/O, it is recommended to add a level shifter chip. 03 Environmental Adaptability Confirm the operating temperature. The industrial standard (-40~85 °C) covers the vast majority of outdoor base station and switch requirements. Temperature drift is controlled within ±25 ppm, ensuring long-term stable operation. Typical Application Scenario Examples FPGA High-Speed Transceiver Reference Clock Xilinx Kintex-7 GTX transceivers require 0.05 ps jitter; it can be soldered directly near the core pins, saving approximately 0.45 USD in extra filter costs. 56G Switch Chip Synchronous Clock Synchronous ports require 125 MHz ±20 ppm. The OB-U series has excellent industrial-grade temperature drift specifications, and its jitter indicator is 10 times better than the chip specification, ensuring link eye diagram margin > 20%, easily passing SI simulation verification. Purchasing and Board-Level Verification Checklist Stock and Price Reference Minimum order 1k reel, unit price range 1.55~1.68 USD Bulk quantities (≥1 k) can be negotiated down to 1.49 USD Small batch sample unit price approx. 1.72 USD, immediate shipping from stock 3 Must-Test Items Checklist Phase Noise: Confirm 12 k-20 MHz integration Full-Temperature Power Consumption: Current required at -40~85 °C Start-up Timing: VDD rising to clock stability Frequently Asked Questions (FAQ) Is 50 fs phase jitter enough for the OBEWDLVTNY-125? + The measured 0.05 ps (50 fs) RMS is far below the 0.3 ps requirement of 56G SerDes, with a margin up to 6 times. It can significantly improve link eye diagram quality without blindly pursuing more expensive low-jitter models. What are the actual measurement results for industrial-grade -40~85 °C drift? + 100 cycles of environmental chamber testing show a maximum frequency drift of +18 ppm, well below the ±25 ppm specification upper limit, with no abnormal frequency hopping, making it very suitable for outdoor base station applications. How is the long-term aging rate performance? + Based on 1,000 hours of accelerated aging test conversion, the annual drift at 85 °C is Can a 2.5 V power supply be used? + Although the OB-U series can still operate at 2.5 V, the phase jitter will degrade from 0.05 ps to 0.12 ps. To ensure optimal system performance, it is strongly recommended to stick to a 3.3 V power supply. What are the precautions for layout routing? + Differential pair length difference should be controlled within ≤5 mil, and the 100 Ω termination resistor must be close to the receiver. Clock lines should be kept away from other high-speed signal lines (spacing ≥ 3 times the line width) to reduce crosstalk and further optimize the eye diagram. Selection Summary Just 5 minutes: Check against the quick-check table → Three-step quick-matching process → Implementation of the verification checklist. 0.05 ps Ultra-low Jitter 3.3 V Standard Voltage -40~85 °C Industrial Grade OBEWDLVTNY-125: Making high-speed communication selection simple again.