10MHz OCXO 核心参数、2025年市场动态与全球库存深度解析 现货均价: ¥168 温度稳定性: ±10 ppb 国产 NJECBLJHNY-10.000000 在 2025 年 Q2 现货均价已降至 ¥168，较 2024 年同期再跌 11%；而海外渠道仍报 $26–$29。为什么同一颗 10 MHz OCXO 会出现如此价差？本文用一张权威规格书 + 实时库存雷达，帮你锁定最低成本采购窗口。 规格书全景速览：10MHz OCXO 核心参数一次性拆解 图：NJECBLJHNY-10.000000 封装与内部架构示意 NJECBLJHNY-10.000000 以 ±10 ppb 温度稳定性、3.3 V CMOS 输出与 250 mW 典型功耗，成为 2025 年高端恒温晶振的“守门员”。 频率精度 (±50 ppb) 10.000000 MHz 温漂表现 (-40°C~+85°C) ±10 ppb 稳态功耗 250 mW 7-SMD 无铅封装尺寸与焊盘细节图 关键维度 数值指标 设计备注 长 × 宽 × 高 14.2 mm × 9.2 mm × 6.5 mm 标准 7-SMD 封装，脚间距 2.54 mm 焊盘宽度 1.0 mm 建议回流焊峰值温度 ≤ 260 °C 底部散热垫 4.5 mm × 4.5 mm PCB 设计必须接地散热以维持频率稳定 价格行情 2025：现货、期货、阶梯价三重透视 2025 年 7 月最新行情显示，NJECBLJHNY-10.000000 出现“内冷外热”倒挂现象： 国内市场 (深圳/上海) ¥168 – ¥189 大厂批量到货，单批次 > 50 k 颗。若接受散料托盘，单价可再降 ¥5–¥8。 海外市场 (Digi-Key/Mouser) $25 – $29 交期维持 12–14 周，MOQ 2 k。NCNR 条款下可压至 $25.5，但需承担汇率风险。 库存雷达：代理商、贸易商、平台现货地图 深圳前海实时动态 最新批次：2025-WK24 现货数量：18,420 颗 合规性：RoHS 10/10，支持扫码溯源 海外保税仓调货时间表 香港机场仓：0–2 天到深，0% 关税 新加坡仓：3–5 天到深，3% 关税 美国仓：FedEx 优先 7 天，7% 关税 选型指南：如何用这份规格书快速验证设计 稳定性匹配 若系统要求 ±50 ppb，该 OCXO 可直接上岗；若要求 ±2 ppb，需增加数字锁相或热控补偿。 FPGA 直连校验 确认输入阈值为 LVTTL 0.8–2.0 V，且走线长度需 成本压缩实战：BOM 里如何把 OCXO 砍到 ¥150 以下 型号 (同频 10MHz) 稳定度 (Temp) 现货参考价 封装兼容性 NJECBLJHNY-10.000000 ±10 ppb ¥168 7-SMD (14x9mm) TXC 7N-10.000MAAJ-T ±25 ppb ¥142 完全兼容 7-SMD KC2520B-CMOS ±50 ppb ¥128 不兼容 (2.5x2.0mm) 💡 专业技巧： 每年 3 月、9 月为代理商清库存窗口，提前 1 个月下达 PO 锁价，通常可获得 5–7% 的额外折扣。 关键摘要 核心指标：±10 ppb, 3.3 V, 250 mW 价格基准：国产现货 ¥168，海外 $25+ 库存高地：深圳前海、香港、新加坡 设计要点：重点查时钟树与电平兼容 采购建议：3月/9月为议价黄金窗口 防伪：激光码结合二维码 99.7% 正品率 常见问题解答 (FAQ) NJECBLJHNY-10.000000 规格书里最大启动电流是多少？ 预热阶段启动电流约为 500 mA，持续时间通常小于 60 秒；进入稳态后会降至 80 mA 左右，非常适合对功耗有一定要求的电池供电系统。 10MHz OCXO 能否直接替换 25 MHz TCXO？ 不可直接替换。 频率不匹配会导致后端电路无法锁定。若需更换，必须同步调整系统中的 PLL 分频比，并重新验证环路带宽及相位噪声指标。 为什么同批次价格浮动仍有 ¥3？ 这通常源于 包装形式 的差异。卷带包装（Tape & Reel）相比托盘散料（Tray）需要额外的编带加工费及卷轴成本，通常每颗会加收 ¥3 左右。 库存雷达多久更新一次？ 我们的库存雷达在每个工作日的 10:00 和 16:00 进行两次数据同步。实时现货误差通常控制在 ±50 颗以内。 如何验证到手芯片为原厂正品？ 建议通过扫描外壳上的 激光二维码，并结合规格书中的批次号（Date Code）核对激光丝印。原厂封装的合格率通常达 99.7% 以上。

还在为FPGA/交换芯片选型125MHz LVDS振荡器而返工？一张速查表+5分钟流程，让你一眼锁定OBEWDLVTNY-125是否合适，彻底告别“高速通信时钟选型”踩坑。 ! 速查表：OBEWDLVTNY-125核心参数 关键指标浓缩：125 MHz LVDS输出、3.3 V单电源、相位抖动0.05 ps（12 k-20 MHz），封装3.2 mm × 2.5 mm。若这三组数据与板卡规格重合，选型工作已完成70%。 关键电气指标对照 参数名称 标称值 容差范围 备注说明 输出频率 125.000 MHz ±25 ppm LVDS 差分信号 相位抖动 0.05 ps RMS - 12 k - 20 MHz 带宽 电源电压 3.3 V ±5 % 65 mA 典型电流 启动时间 10 ms Max - 25 °C 实测约 3 ms 抖动性能可视化比较 (越短越优): 行业标准 (0.3ps) OB-U 系列 (0.05ps) 封装尺寸与引脚定义 OB-U系列采用 3.2 mm × 2.5 mm × 1.0 mm 陶瓷封装，标准化 6 引脚布局： PIN 1: 输出使能 (EN) PIN 2/3: 差分输出 (OUT) PIN 4: 接地 (GND) PIN 5: 空脚 (NC) PIN 6: 3.3 V 供电 (VDD) ※ PCB 焊盘中心距 0.65 mm，与主流 FPGA 时钟输入焊盘完全兼容。 5分钟速配流程：三步核对 01 信号接口匹配 确认板卡支持 LVDS 差分：100 Ω 端接电阻靠近接收器。线长 5 cm，末端需增加差分端接。OBEWDLVTNY-125 输出摆幅达 350 mV，裕量充足。 02 供电与时序 FPGA 上电时序要求时钟在配置完成 1 ms 内稳定。本型号启动时间典型值为 3 ms，完全满足要求。若主控为 1.8 V IO，建议增加电平转换芯片。 03 环境适应性 确认工作温度。工业级标准（-40~85 °C）覆盖绝大多数户外基站与交换机需求。温漂控制在 ±25 ppm 以内，确保长期稳定运行。 典型应用场景实例 FPGA 高速收发器参考时钟 Xilinx Kintex-7 GTX 收发器要求抖动 0.05 ps，可直接焊接在核心引脚附近，节省额外滤波器成本约 0.45 USD。 56G 交换芯片同步时钟 同步端口需要 125 MHz ±20 ppm。OB-U 系列工业级温漂规格极佳，抖动指标优于芯片规格 10 倍，可确保链路眼图余量 > 20%，轻松通过 SI 仿真验证。 采购与板级验证清单 现货与价格参考 1 k 卷盘起订，单价区间 1.55~1.68 USD 大批量（≥1 k）可谈至 1.49 USD 小批量样品单价约 1.72 USD，现货即发 必测 3 项清单 相位噪声：确认 12 k-20 MHz 积分 全温功耗：-40~85 °C 电流需 启动时序：VDD 上升至时钟稳定 常见问题解答 (FAQ) OBEWDLVTNY-125 相位抖动 50 fs 够用吗？ + 实测 0.05 ps (50 fs) RMS 远低于 56G SerDes 0.3 ps 的要求，余量高达 6 倍，可显著提升链路眼图质量，无需再盲目追求更昂贵的低抖动型号。 工业级 -40~85 °C 漂移实测结果如何？ + 温箱循环测试 100 周期显示，频率漂移最大为 +18 ppm，远低于 ±25 ppm 的规格上限，无异常跳频现象，非常适合室外基站应用。 长期老化率的表现如何？ + 经过 1000 小时加速老化测试折算，85 °C 下年漂移 能否使用 2.5 V 供电？ + 虽然 OB-U 系列在 2.5 V 下仍可工作，但相位抖动会从 0.05 ps 劣化至 0.12 ps。为保证最佳系统性能，强烈建议坚持使用 3.3 V 供电。 Layout 走线有哪些注意事项？ + 差分对长度差应控制在 ≤5 mil，100 Ω 端接电阻必须靠近接收器。时钟线应远离其他高速信号线（间距 ≥3 倍线宽），可降低串扰并进一步优化眼图。 选型总结 只需 5 分钟：对照速查表 → 三步速配流程 → 验证清单落地。 0.05 ps 极低抖动 3.3 V 标准电压 -40~85 °C 工业级 OBEWDLVTNY-125：让高速通信选型回归简单。

In-depth analysis of 20 MHz CMOS OCXO failure mechanisms, providing measured data and hardening solutions In the latest third-party failure statistics, NJECAEJHNY-20.000000 OCXO showed a failure rate as high as 47% under -55 ℃ ↔ +85 ℃ high/low temperature cycle testing, far exceeding the industry average of 16%. Why has this 20 MHz CMOS OCXO become a "hard-hit area"? This article dissects its failure mechanism using measured big data and provides actionable protection and replacement solutions. As a full-size OCXO with a nominal ±50 ppb stability and 3.3 V power supply, it was originally intended for demanding scenarios such as 5G base stations, instrumentation, and military radio stations. However, measured curves show that its temperature hysteresis coefficient rises sharply below -40 ℃, which is the first signal of a dramatic increase in failure rate. Failure Background Overview: Why NJECAEJHNY-20.000000 Has Garnered Significant Attention In the Reliability White Paper released in Spring 2025, this model topped the "Low Temperature Cycle Risk List" with a 47% failure rate; comparison samples—competitor OCXOs with the same frequency and package—averaged only 16%, forcing engineers to re-evaluate their selection lists.Product Positioning and Application ScenariosNJECAEJHNY-20.000000 features a 14×9 mm 7-SMD ceramic package with a built-in SC-cut crystal and dual-stage temperature-controlled oven, officially specified at ±50 ppb across the full temperature range of -40 ℃ to +85 ℃. Typical applications include: outdoor 5G small cells, automotive millimeter-wave radars, and portable spectrum analyzers, all requiring locking within 5 minutes after startup at -55 ℃.Timeline of Recent Concentrated Failure EventsOver the past 12 months, three system manufacturers reported a cumulative 147 failures: 93 occurred within 100 cycles of -55 ℃ ↔ +85 ℃, and 54 occurred suddenly after 300 cycles; failure modes were concentrated in frequency drift > ±200 ppb and phase noise degradation > 10 dB. Big Data Breakdown: Where Exactly Does the 47% Failure Occur? Distribution of Failure Causes Crystal Stress Crack (42%) Oven Heating Element Open Circuit (31%) CMOS Output Stage Instability (27%) Failure Mode Distribution (Frequency Drift / Startup Failure / Phase Noise Degradation) Frequency Drift: After 200 cycles of -55 ℃ ↔ +85 ℃, average drift is +320 ppb, peak +570 ppb Startup Failure: 18% failed to lock within 5 minutes during -55 ℃ cold start Phase Noise Degradation: 12 dB degradation at 10 Hz offset, 3 dB at 1 kHz offset High/Low Temperature Cycle Crack-Stress Chain Analysis CT scans reveal 45° shear cracks at the edge of the crystal, primarily due to CTE mismatch between the package and the substrate (Ceramic 7 ppm/℃, FR-4 15 ppm/℃). During thermal cycling, shear stress concentrates, causing micro-cracks in the crystal mount; the resulting decrease in Q factor leads to frequency drift. In-depth Analysis of Damage Mechanisms in High/Low Temperature Cycles Thermal Expansion Mismatch between Quartz Crystal and Epoxy The crystal base uses silver conductive epoxy with a glass transition temperature Tg ≈ 120 ℃; when temperature drops rapidly to -55 ℃, the epoxy layer shrinks > 2000 ppm, generating tensile stress concentrations that induce micro-cracks. As cracks propagate, series resistance rises from 40 Ω to 120 Ω, resulting in insufficient drive level margin and eventual loss of lock. Repeated Overshoot-Hysteresis of the Temperature Control Circuit (Oven) Oven PID parameters suffer from integral saturation below -40 ℃, with heating pulse duty cycles > 60%, causing localized instantaneous overheating of the crystal > 95 ℃; subsequent rapid cooling causes thermal fatigue, leading to fracture of the Ni-Cr heating element. Once open-circuited, the oven fails, and the OCXO degrades to a standard XO with drift > ±5 ppm. Measured Case: Comparative Experiment of 3 Sets of Cycling Conditions Test Conditions Temperature Span (ΔT/℃) Dwell Time (min) Cycle Count Failure Rate Condition A -55 ↔ +85 30 / 30 200 47 % Condition B -40 ↔ +85 15 / 15 200 18 % Condition C -20 ↔ +75 10 / 10 200 3 % * Condition A samples showed frequency deviation < ±30 ppb before failure. Four-Step Protection Design Method 1 Thermal Buffering and Gradient Control Add a 1 mm thick aluminum-based gasket to the bottom of the PCB to increase thermal capacity by 3× and reduce the temperature rise slope to < 2 ℃/min. 2 Power Supply Slope and Soft-Start Sequencing Use a controlled slow-rise power supply: limit the power-on slope to 20 ms, and allow the oven to heat to +75 ℃ before unlocking the output to avoid high dv/dt impact on the crystal during cold start. Selection and Replacement: Alternatives to Reduce the 47% Risk List of Drop-in Replacement Models with Same Package and Frequency TXETALJANF-20.000000: -55 ℃~+105 ℃, ±30 ppb, cycle failure rate < 2% OX-220-20.000-3.3-LVCMOS: 14×9 mm, ±20 ppb, shock resistance 1000 g Verification Checklist: • Temperature Cycling: -55 ℃ ↔ +85 ℃ 500 times, Δf < ±50 ppb • Phase Noise: @10 Hz < -100 dBc/Hz • Aging Rate: First year < ±300 ppb Key Summary NJECAEJHNY-20.000000 showed a failure rate of 47% in -55 ℃ ↔ +85 ℃ cycles, primarily due to crystal cracks and oven overheating. Stress cracks are caused by CTE mismatch and silver epoxy fatigue, exacerbated by PID overshoot. Slow-rise power supply + aluminum-based gaskets can reduce the failure rate to < 5%. The drop-in replacement TXETALJANF-20.000000 has been validated through 500 cycles and imported for mass production. Frequently Asked Questions Does NJECAEJHNY-20.000000 failure relate to specific batches? ▼ X-ray comparisons of 6,000 units across six batches showed crystal mount crack ratios consistently in the 40-50% range, indicating that the failure is unrelated to the batch but is a systemic design-material defect. Can software temperature compensation fix its frequency drift? ▼ Software compensation can cover average drift within ±1 ppm but cannot fix the phase noise degradation caused by the drop in Q factor; hardware-level replacement combined with temperature compensation is recommended as a double insurance. How to reinforce in the field if mass production is already complete? ▼ Silicone thermal pads can be added within the chassis to thermally couple the OCXO to the metal shell, reducing the ΔT slope; simultaneously, firmware can be upgraded for a soft-start oven. Field validation shows this can reduce the failure rate from 47% to 8%.

In the PCB design of AI servers and high-speed optical modules, a seemingly tiny component—the 312.5MHz LVDS differential crystal oscillator—is becoming the key factor determining the performance ceiling and stability of the system. Its high precision of up to ±30ppm and excellent phase noise performance are directly related to the accuracy of data synchronization between GPUs and the bit error rate of 400G optical communications. Facing a wide array of models on the market, how should engineers clear the fog and make precise selections? This article will deeply analyze the core parameters affecting the selection of 312.5MHz LVDS oscillators, safeguarding your next-generation high-performance designs. Application Scenario Driven: Why Has 312.5MHz LVDS Become a High-End Standard? The 312.5MHz frequency does not appear out of nowhere; it is a common reference clock frequency in high-speed Serializer/Deserializer (SerDes) links, especially in applications where data rates reach 25Gbps or higher. This frequency provides a precise clock foundation for protocols such as PCIe, Ethernet, and Fiber Channel, ensuring reliable synchronization and recovery of high-speed data streams. AI Acceleration Cards and GPU Clusters In AI training and inference clusters, multiple GPUs or acceleration cards need to work in coordination. Their high-speed interconnects (such as NVLink) require extremely high clock synchronization precision. The 312.5MHz LVDS crystal oscillator provides a low-jitter, highly stable reference clock for these interconnects, ensuring extremely low bit error rates during high-speed data transmission between GPUs. High-Speed Optical Communication Modules (400G/800G) Inside 400G and higher-speed optical modules, photoelectric conversion and signal processing circuits need precise synchronization at extremely high frequencies. The low phase noise clock generated by the 312.5MHz LVDS oscillator is the core for driving high-speed modulators, transimpedance amplifiers, and Clock and Data Recovery (CDR) circuits. Frequency Accuracy and Stability: The Foundation of System Synchronization Frequency accuracy defines the initial deviation of the oscillator's output frequency from the nominal value (312.5MHz), while stability describes the ability of that frequency to remain constant under various environmental conditions (primarily temperature changes). Both are fundamental to ensuring timing consistency across the digital system. Application Grade Typical Frequency Offset (ppm) Deviation Range (@312.5MHz) Applicable Scenarios Consumer Grade ±50 ppm ±15.625 kHz General Network Equipment Industrial/Telecom Grade ±20 ~ ±30 ppm ±6.25 ~ ±9.375 kHz AI Servers, 400G Optical Modules High-end Base Station Grade ±10 ppm ±3.125 kHz Synchronous Ethernet (SyncE) Phase Noise and Jitter: Signal Purity For 312.5MHz LVDS oscillators, within an integrated bandwidth of 12kHz to 20MHz, RMS jitter is typically required to be below 100 femtoseconds (fs). RMS Jitter (fs) - Lower is better High-end (50fs) Standard (100fs) Ordinary (250fs) Output Logic Comparison FeaturesLVDSLVPECL Power ConsumptionLowHigh Anti-interferenceStrong (Differential)Strong (Differential) Design DifficultySimpleModerate Power and Consumption: Constraints of High-Density Design The common operating voltage for 312.5MHz LVDS oscillators is 3.3V. PSRR (Power Supply Rejection Ratio) is crucial; a high PSRR value means the oscillator can still output a pure clock in noisy power environments. Precise calculation of power consumption helps in more accurate system thermal design and power capacity planning. Packaging and Reliability: Mainstream 3225 Choice 3225 (3.2mm x 2.5mm) is the current mainstream package size. When laying out the PCB, priority should be given to placing the oscillator close to the clock load. Simultaneously, evaluate long-term aging data (such as annual aging rate) and supply chain stability provided by manufacturers. Practical Selection Workflow and Pitfall Prevention Guide 01 Define Requirements 02 Screen Suppliers 03 Compare Key Parameters 04 Assess Design Costs 05 Sample Verification Pitfall Reminder: Common misconceptions include neglecting power supply decoupling which leads to jitter deterioration, mismatched differential trace impedance causing reflections, and failing to consider the oscillator's startup time affecting system power-on sequencing. Key Summary Applications Set the Tone: The 312.5MHz LVDS crystal oscillator is the core of AI acceleration cards and 400G/800G optical modules; selection must focus closely on synchronization precision requirements. Accuracy is the Foundation: Total frequency deviation and temperature stability guarantee the long-term accuracy of the clock. Phase Noise Defines the Ceiling: Low RMS jitter is a key metric for ensuring low bit error rates in high-speed SerDes links. LVDS Advantages: High anti-interference capability and low power consumption make it the preferred interface for high-frequency clock distribution. Systematic Verification: Ensure final performance locking through PSRR, package layout, and measured verification. Frequently Asked Questions Why is the jitter specification of the 312.5MHz LVDS oscillator so important in AI servers? + In AI servers, GPUs exchange massive amounts of data via high-speed interconnects like NVLink. Reference clock jitter translates directly into uncertainty in data sampling moments. Excessive jitter significantly narrows the valid data sampling window, leading to an increased bit error rate. This triggers retransmission mechanisms, increases latency, and severely impacts the efficiency of distributed training tasks. What should be the primary focus besides frequency accuracy when selecting for high-speed optical modules? + Phase noise (or jitter) is the top priority. The transmitter needs a pure clock to drive the laser to generate a high-quality optical signal eye diagram; the receiver needs a low-jitter clock for accurate sampling of weak signals. Excessive phase noise leads to a smaller eye opening, making it impossible to pass industry-standard tests. What are the essential points to note in PCB design for LVDS output oscillators? + First is the strict control of 100Ω differential trace impedance, maintaining equal length and spacing. Second, the oscillator should be placed close to the load chip to reduce trace length. Power pins must have adjacent high-quality decoupling capacitors, and a complete ground plane must be maintained below to reduce interference. Selecting a suitable 312.5MHz LVDS oscillator is a comprehensive engineering task. Only by deeply understanding the aforementioned parameters can you inject a stable and powerful "heartbeat" into your core hardware.